View TLP140G_1360388.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

tlpxxm/g/g-1 ? powerso-10 tm tlpxxm tripolar overvoltage protection for telecom line application specific discretes a.s.d. ? september 1998 - ed : 3c d 2 pak tlpxxg i 2 pak tlpxxg-1 main applications any sensitive telecom equipment requiring protec- tion against lightning : analog and isdn line cards main distribution frames terminal and transmission equipment gas-tube replacement description the tlpxxm/g/g-1 series are tripolar transient surge arrestors used for primary and secondary protection in sensitive telecom equipment. features tripolar crowbar protection voltage range selected for telecom applications repetitive peak pulse current : i pp = 100 a (10 / 1000 m s) holding current : i h = 150 ma low capacitance : c = 110 pf typ. low leakage current : i r = 5 m a max benefits no ageing and no noise. if destroyed, the tlpxxm/g/g-1 falls into short circuit, still ensuring protection. access to surface mount applications thanks to the powerso-10 tm and d 2 pak package. tm: asd and powerso-10 are trademarks of st microelectronics. ring tip gnd ring tip ring tip ring tip ring tip tab gnd gnd ring tip tab gnd gnd ring tip 1/14
complies with the following standards: peak surge voltage (v) voltage waveform ( m s) current waveform ( m s) admissible ipp (a) necessary resistor ( w ) ccitt k20 4000 10/700 5/310 100 - vde0433 4000 10/700 5/310 100 - vde0878 4000 1.2/50 1/20 100 - iec-1000-4-5 level 4 level 4 10/700 1.2/50 5/310 8/20 100 100 - - fcc part 68, lightning surge type a 1500 800 10/160 10/560 10/160 10/560 200 100 - - fcc part 68, lightning surge type b 1000 5/320 5/320 25 - bellcore tr-nwt-001089 first level 2500 1000 2/10 10/1000 2/10 10/1000 500 100 - - bellcore tr-nwt-001089 second level 5000 2/10 2/10 500 - cnet i31-24 4000 0.5/700 0.8/310 100 - analog main distribution frame line card tlpxxm/g/g-1 typical application primary protection module tlpxxm/g/g-1 ring relay line a line b lcp1511d -v bat slic 220 nf ptc ptc analog line card protection tlpxxm/g/g-1 2/14
symbol parameter value unit i pp peak pulse current (longitudinal & transversal mode) : 10/1000 m s (open circuit voltage waveform 1 kv 10/1000 m s) 8/20 m s (open circuit voltage waveform 4 kv 1.2/50 m s) 2/10 m s (open circuit voltage waveform 2.5kv 2/10 m s) 100 250 500 a a a i tsm mains power induction vrms = 300v, r = 600 w t = 200ms 0.7 a mains power contact v rms = 220v, r = 10 w (fail-safe threshold) t = 200 ms 31 a v rms = 220v, r = 600 w t = 15 mn 0.42 a t stg storage temperature range - 55 to + 150 c tj maximum operating junction temperature 150 c t l maximum lead temperature for soldering during 10 s 260 c t op operating temperature range - 40 to + 85 c absolute maximum ratings (t amb = 25c) symbol description i pp peak pulse current i tsm maximum peak on-state current i r leakage current i rm leakage current i h holding current v br breakdown voltage v r continuous reverse voltage v rm maximum stand-off voltage v bo breakover voltage c capacitance parameter measurement information v rm v r v bo i h i r i rm i pp tlpxxm/g/g-1 r4 r5 r3 feeder +5v 1/2 da108s1 internal circuitry power typical application isdn: u interface protection tlpxxm/g/g-1 3/14
type i rm @ v rm i r @ v r c max. max. typ. note m av m avpf tlp140m/g/g-1 5 120 50 140 35 tlp200m/g/g-1 5 180 50 200 35 tlp270m/g/g-1 5 230 50 270 35 note : v r = 50 v bias, v rms = 1v, f = 1 mhz. electrical characteristics between tip and ring (t amb = 25c) type i rm @ v rm i r @ v r v bo @ i bo ih c @ v r max. max. max. max. min. typ. note 1 note 2 note 3 note 4 note 5 m av m av vmamapfpf tlp140m/g/g-1 5 120 50 140 200 500 150 110 40 tlp200m/g/g-1 5 180 50 200 290 500 150 110 40 tlp270m/g/g-1 5 230 50 270 400 500 150 110 40 note 1: i r measured at v r guarantees v br min > v r . note 2: measured at 50 hz. note 3: see functional holding current test circuit. note 4: v r = 0v bias, v rms = 1v, f = 1 mhz. note 5: v r = 50v bias, v rms = 1v, f = 1 mhz (tip or ring (-) / gnd (+)). electrical characteristics between tip and gnd, ring and gnd (t amb = 25c) symbol parameter value unit rth (j-c) junction to case tlpxxm tlpxxg tlpxxg-1 1.0 1.0 1.0 c/w rth (j-a) junction to ambient tlpxxm tlpxxg tlpxxg-1 see table page 14 see table page 14 see table page 14 c/w thermal resistance tlpxxm/g/g-1 4/14
functional holding current (i h ) test circuit: go-no go test r -v p v bat - 48 v = surge generator d.u.t. this is a go-no go test which allows to confirm the holding current (i h ) level in a functional test circuit. test procedure : - adjust the current level at the i h value by short circuiting the d.u.t. - fire the d.u.t. with a surge current : i pp = 10a, 10/1000 m s. - the d.u.t. will come back to the off-state within a duration of 50ms max. order code package types marking powerso-10 tlp140m tlp200m tlp270m tlp140m tlp200m tlp270m d 2 pak TLP140G tlp200g tlp270g TLP140G tlp200g tlp270g i 2 pak TLP140G-1 tlp200g-1 tlp270g-1 TLP140G tlp200g tlp270g marking tpl 270 m - tr breakdown voltage packaging: -tr = tape and reel only for "m" version (600 pcs) = tube (50 pcs) tripolar line protection package: m : power so10 g : d 2 pak g-1 : i 2 pak tlpxxm/g/g-1 5/14
0.01 0.1 1 10 100 1000 0 10 20 30 40 50 60 70 80 90 100 t(s) itsm(a) f=50hz tj initial=25c tip or ring vs gnd fig. 1: maximum peak on-state current versus pulse duration. -40-20 0 20406080 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 tamb (c) ih (tamb) / ih (25c) fig. 2: relative variation of i h versus t amb . tip gnd ring 10 / 1000 s 100 a surge generator v bo tip ring v bo tip - gnd fig. 4: test diagram for breakover voltage measurement. 1 10 100 200 10 20 50 100 200 c(pf) f=1mhz vosc=1vrms tj=25c line- / gnd+ line / line line+ / gnd- vr(v) fig. 3-1 : junction capacitance versus applied re- verse voltage (typical values) (tlp140m/g/g-1). 1 10 100 200 10 20 50 100 200 c(pf) f=1mhz vosc=1vrms tj=25c line- / gnd+ line / line line+ / gnd- vr(v) fig. 3-2 : junction capacitance versus applied re- verse voltage (typical values) (tlp200m/g/g-1). 1 10 100 300 10 20 50 100 200 c(pf) f=1mhz vosc=1vrms tj=25c line- / gnd+ line / line line+ / gnd- vr(v) fig. 3-3 : junction capacitance versus applied re- verse voltage (typical values) (tlp270m/g/g-1). tlpxxm/g/g-1 6/14
0.01 0.1 1 10 100 1,000 10,000 100,000 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 dv/dt vbr/vbr tip ring tip+ gnd - tip- gnd + fig. 5-1 : breakover voltage measurement (tlp140m/g/g-1). 0.01 0.1 1 10 100 1,000 10,000 100,000 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 dv/dt vbo/vbr tip ring tip+ gnd - tip- gnd + fig. 5-2 : breakover voltage measurement (tlp200m/g/g-1). 0.01 0.1 1 10 100 1,000 10,000 100,000 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 dv/dt vbo/vbr tip+ gnd - tip ring tip- gnd + fig. 5-3 : breakover voltage measurement (tlp270m/g/g-1). tlpxxm/g/g-1 7/14
package mechanical data d 2 pak plastic a c2 d r 2.0 min. flat zone a2 v2 c a1 g l l3 l2 b b2 e ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.40 0.055 c 0.45 0.60 0.017 0.024 c2 1.21 1.36 0.047 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.28 0.393 0.405 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 r 0.40 0.016 v2 0 8 0 8 foot-print d 2 pak 8.90 3.70 1.30 5.08 16.90 10.30 tlpxxm/g/g-1 8/14
package mechanical data i 2 pak plastic ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.20 1.38 0.047 0.054 b2 1.25 1.40 0.049 0.055 c 0.45 0.60 0.018 0.024 c2 1.21 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 2.44 2.64 0.096 0.104 e 10.00 10.28 0.394 0.405 l 13.10 13.60 0.516 0.535 l1 3.48 3.78 0.137 0.149 l2 1.27 1.40 0.050 0.055 v5 5 v4 45 45 tlpxxm/g/g-1 9/14
package mechanical data power-so10 e2 e 1 10 5 6 h eb 0.25 m d h a f a1 e4 e3 e1 seating plane seating plane a b c q detail "a" 0.10 a b l a1 a detail "a" d1 ref. dimensions millimeters inches min. typ. max. min. typ. max. a 3.35 3.65 0.131 0.143 a1 0.00 0.10 0.00 0.0039 b 0.40 0.60 0.0157 0.0236 c 0.35 0.55 0.0137 0.0217 d 9.40 9.60 0.370 0.378 d1 7.40 7.60 0.291 0.299 e 9.30 9.50 0.366 0.374 e1 7.20 7.40 0.283 0.291 e2 7.20 7.60 0.283 0.299 ref. dimensions millimeters inches min. typ. max. min. typ. max. e3 6.10 6.35 0.240 0.250 e4 5.90 6.10 0.232 0.240 e 1.27 0.05 f 1.25 1.35 0.0492 0.0531 h 13.80 14.40 0.543 0.567 h0.50 0.019 l 1.20 1.80 0.0472 0.0708 q1.70 0.067 a0 80 8 tlpxxm/g/g-1 10/14
header shape foot print power-so10 mounting pad layout recommended shipping tube dimensions (mm) typ a b c length tube 18 12 0,8 532 quantity per tube 50 dimensions in millimeters dimensions in millimeters surface mount film taping : contact sales office b c a tlpxxm/g/g-1 11/14
soldering recommendation the soldering process causes considerable ther- mal stress to a semiconductor component. this has to be minimized to assure a reliable and ex- tended lifetime of the device. the powerso-10 package can be exposed to a maximum tempera- ture of 260c for 10 seconds. however a proper soldering of the package could be done at 215c for 3 seconds. any solder temperature profile should be within these limits. as reflow techniques are most common in surface mounting, typical heating profiles are given in figure 1,either for mounting on fr4 or on metal-backed boards. for each particular board, the appropriate heat profile has to be adjusted experimentally. the present proposal is just a starting point. in any case, the fol- lowing precautions have to be considered : - always preheat the device - peak temperature should be at least 30 c higher than the melting point of the solder alloy chosen - thermal capacity of the base substrate voids pose a difficult reliability problem for large surface mount devices. such voids under the package result in poor thermal contact and the high thermal resistance leads to component fail- ures. the powerso-10 is designed from scratch to be solely a surface mount package, hence symme- try in the x- and y-axis gives the package excellent weight balance. moreover, the powerso-10 offers the unique possibility to control easily the flatness and quality of the soldering process. both the top and the bottom soldered edges of the package are accessible for visual inspection (soldering menis- cus). coplanarity between the substrate and the pack- age can be easily verified. the quality of the solder joints is very important for two reasons : (i) poor quality solder joints result directly in poor reliability and (ii) solder thickness affects the thermal resis- tance significantly. thus a tight control of this pa- rameter results in thermally efficient and reliable solder joints. fig. 1 : typical reflow soldering heat profile time (s) temperature ( c) 0 40 80 120 160 200 240 280 320 360 0 50 100 150 200 250 o 215 c o soldering preheating cooling 245 c o epoxy fr4 board metal-backed board tlpxxm/g/g-1 12/14
substrates and mounting information the use of epoxy fr4 boards is quite common for surface mounting techniques, however, their poor thermal conduction compromises the otherwise outstanding thermal performance of the powerso- 10. some methods to overcome this limitation are discussed below. one possibility to improve the thermal conduction is the use of large heat spreader areas at the cop- per layer of the pc board. this leads to a reduction of thermal resistance to 35 c for 6 cm 2 of the board heatsink (see fig. 2). use of copper-filled through holes on conventional fr4 techniques will increase the metallization and decrease thermal resistance accordingly. using a configuration with 16 holes under the spreader of the package with a pitch of 1.8 mm and a diameter of 0.7 mm, the thermal resistance (junction - heatsink) can be reduced to 12c/w (see fig. 3). beside the thermal advantage, this solution allows multi-layer boards to be used. however, a draw- back of this traditional material prevents its use in very high power, high current circuits. for instance, it is not advisable to surface mount devices with currents greater than 10 a on fr4 boards. a power mosfet or schottky diode in a surface mount power package can handle up to around 50 a if better substrates are used. fig. 2 : mounting on epoxy fr4 head dissipation by extending the area of the copper layer fig. 3 : mounting on epoxy fr4 by using copper-filled through holes for heat transfer fr4 board copper foil fr4 board copper foil heat transfer heatsink tlpxxm/g/g-1 13/14
printed circuit board material r th (j-a) p diss 1.fr4 using the recommended pad-layout 50 c/w 1.5 w 2.fr4 with heatsink on board (6cm 2 ) 35 c/w 2.0 w 3.fr4 with copper-filled through holes and external heatsink applied 12 c/w 5.8 w 4. ims floating in air (40 cm 2 ) 8 c/w 8.8 w 5. ims with external heatsink applied 3.5 c/w 20 w table 1 a new technology available today is ims - an insu- lated metallic substrate. this offers greatly en- hanced thermal characteristics for surface mount components. ims is a substrate consisting of three different layers, (i) the base material which is available as an aluminium or a copper plate, (ii) a thermal conductive dielectrical layer and (iii) a copper foil, which can be etched as a circuit layer. using this material a thermal resistance of 8c/w with 40 cm 2 of board floating in air is achievable (see fig. 4). if even higher power is to be dissipated an external heatsink could be applied which leads to an r th (j-a) of 3.5c/w (see fig. 5), assuming that r th (heatsink-air) is equal to r th (junction- heatsink). this is commonly applied in practice, leading to reasonable heatsink dimensions. often power devices are defined by considering the maximum junction temperature of the device. in practice , however, this is far from being exploited. a summary of various power management capa- bilities is made in table 1 based on a reasonable delta t of 70c junction to air. the powerso-10 concept also represents an attractive alternative to c.o.b. techniques. powerso-10 offers devices fully tested at low and high temperature. mounting is simple - only conventional smt is required - enabling the users to get rid of bond wire problems and the problem to control the high temperature soft soldering as well. an optimized thermal management is guaranteed through powerso-10 as the power chips must in any case be mounted on heat spreaders before being mounted onto the substrate. fig. 4 : mounting on metal backed board fig. 5 : mounting on metal backed board with an external heatsink applied fr4 board copper foil aluminium heatsink copper foil insulation aluminium information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1998 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - mexico - morocco - the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. http://www.st.com tlpxxm/g/g-1 14/14

▲Up To Search▲

Price & Availability of TLP140G

	To Download TLP140G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .